The market in Asia Pacific is expected to show a remarkable increase in revenue share from about 15% by the end of 2017 to almost 21% by the end of 2025, registering an increase of a remarkbale 550 basis points in value share over the period.
Food & Beverage sector is the biggest downstream user of Active, Smart and Intelligent Packaging, accounting for 18% in 2017.
The global Active, Smart, and Intelligent Packaging market was valued at 16100 million US$ in 2018 and will reach 32300 million US$ by the end of 2025, growing at a CAGR of 9.1% during 2019-2025.
This report focuses on Active, Smart, and Intelligent Packaging volume and value at global level, regional level and company level. From a global perspective, this report represents overall Active, Smart, and Intelligent Packaging market size by analyzing historical data and future prospect.
Regionally, this report categorizes the production, apparent consumption, export and import of Active, Smart, and Intelligent Packaging in North America, Europe, China, Japan, Southeast Asia and India.Download PDF Brochure for Latest Research Study: https://www.researchmoz.us/enquiry.php?type=S&repid=2514455
For each manufacturer covered, this report analyzes their Active, Smart, and Intelligent Packaging manufacturing sites, capacity, production, ex-factory price, revenue and market share in global market.
The following manufacturers are covered:
PakSense
Landec
Sealed Air
Bemis
Crown
Amcor
3M
Timestrip
Cryolog
Vitsab International
Varcode
LCR Hallcrest
Thin Film Electronics
CCL
Temptime
Multisorb Technologies
Coveris
Table of Contents
Executive Summary
1 Industry Overview of Active, Smart, and Intelligent Packaging
1.1 Definition of Active, Smart, and Intelligent Packaging
1.2 Active, Smart, and Intelligent Packaging Segment by Type
1.3 Active, Smart, and Intelligent Packaging Segment by Applications
1.4 Global Active, Smart, and Intelligent Packaging Overall Market
Inquire More About This Report @ https://www.researchmoz.us/enquiry.php?type=E&repid=25144552 Manufacturing Cost Structure Analysis
2.1 Raw Material and Suppliers
2.2 Manufacturing Cost Structure Analysis of Active, Smart, and Intelligent Packaging
2.3 Manufacturing Process Analysis of Active, Smart, and Intelligent Packaging
2.4 Industry Chain Structure of Active, Smart, and Intelligent Packaging
3 Development and Manufacturing Plants Analysis of Active, Smart, and Intelligent Packaging
3.1 Capacity and Commercial Production Date
3.2 Global Active, Smart, and Intelligent Packaging Manufacturing Plants Distribution
3.3 Major Manufacturers Technology Source and Market Position of Active, Smart, and Intelligent Packaging
3.4 Recent Development and Expansion Plans
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Mr. Nachiket Ghumare,
90 State Street,
Albany NY,
United States – 12207
Tel: +1-518-621-2074
USA-Canada Toll Free: 866-997-4948
Email: sales@researchmoz.us
Follow us on Blogger @ https://buzzpocket.blogspot.com/